印制板工艺流程
印制板工艺流程是电子制造中的重要环节，其涉及到多个步骤和复杂的技术。以下是印制板工艺流程的英文翻译
Pried Circui Board (PCB) maufacurig ivolves a series of processes o rasform a blak shee of copper clad lamiae io a complex elecroic circui board. The PCB maufacurig process ca be broadly classified io wo caegories: he subracive mehod ad he addiive mehod.
Subracive mehod:
1. Copper clad lamiae: A shee of copper is boded o a shee of isulaig maerial usig adhesive.
2. Imagig: A egaive image of he circui desig is pried o he copper clad lamiae usig a phoolihographic process.
3. Echig: The exposed copper is removed by echig, leavig behid he desired circui race paer.
4. Drillig: Holes are drilled i he board o make coecio bewee he layers.
5. Plaig: Coducive maerial is plaed oo he drilled holes o creae elecrical coecios bewee he layers.
6. Surface reame: The board is cleaed ad a proecive coaig is applied.
Addiive mehod:
1. Copper clad lamiae: Similar o he subracive mehod, a shee of copper is boded o a shee of isulaig maerial usig adhesive.
2. Imagig: A posiive image of he circui desig is pried o he copper clad lamiae usig a phoolihographic process.
3. Plaig: Coducive maerial is plaed oly i he desired areas, creaig he circui race paer.
4. Drillig: Holes are drilled i he board o make coecio bewee he layers.
5. Plaig: Coducive maerial is plaed oo he drilled holes o creae elecrical coecios bewee he layers.
6. Surface reame: The board is cleaed ad a proecive coaig is applied.
Boh mehods ivolve several oher processes such as lamiaio, drillig, plaig, ad surface reame ha are esseial for creaig high-qualiy PCBs. The choice of mehod depeds o he specific requiremes of he applicaio, icludig he complexiy of he circui desig, he umber of layers required, ad he desired board hickess.
